International Green Architecture and Construction Materials (Shanghai) Expo 2019


    As the biggest international trade building materials trade fair in China that provides a comprehensive solution for green building, the International Green Building Materials (Shanghai) Expo (ESBUILD) has been deeply rooted in China’s green building industry for fifteen years. In order to implement the regulations, guidelines and policies put forward in the report of the 19th National Congress on “Accelerating the reform of the ecological civilization system and building beautiful China“, and complying with the development trend of green, ecological, healthy and comfortable building materials, ESBUILD 2019 will integrate existing resources re-establishing the concept of “Innovative Safety? beautiful Ecology, and providing Comprehensive Solutions for Green Buildings”.

    And launching the integration of six major sections, which involves building energy-saving, assembled building, exterior wall materials, interior wall materials, building accessories, interior decoration.

    The exhibition will set a total exhibition area of 70,000 square meters, and 1,000 exhibitors will participate. It is expected that the number of visitors will exceed 80,000. ESBUILD 2019 will raise the status quo and trend of green building development to the height of the whole society, planning for the green development clearly defined in the National 13th Five-Year Plan, and unite policies to improve development efficiency.

    Organiser: Shanghai Modern International Exhibition Co Ltd


    Shanghai Modern International Exhibition Co., Ltd, the first authorized exhibition company with ISO9000 in China’s exhibition industry, is a professional exhibition corporation under Shanghai World Expo Group. Moreover, it became a member of UFI (the global association of the exhibition industry) in 2004 .The company always devotes itself to playing a role as bridge and bond in promoting the exchange of trade, science and technology communication home and abroad.