Micron Technology has selected Bechtel to serve as the engineering, procurement, and construction (EPC) partner for the first phase of its leading-edge memory manufacturing complex in Clay, New York, advancing development of what is planned to become the largest semiconductor manufacturing facility in the United States. The decision marks the next stage of the Micron New York Project, with Bechtel set to begin mobilizing immediately at White Pine Commerce Park in Onondaga County. Construction on Micron’s first New York fabrication plant began in January 2026, and the company is now moving into a new phase of execution. The development is described as the largest private investment in New York state history and is projected to contribute approximately $16.7 billion annually in real economic output and around $5.4 billion in annual personal income for New Yorkers over the next three decades.
The manufacturing complex is expected to create 50,000 jobs across New York, including more than 4,500 construction positions. During peak construction activity, thousands of skilled craft workers will be employed, providing opportunities for union trades, apprentices, specialty contractors, suppliers, training program graduates, and construction professionals throughout the state. Micron and Bechtel also plan to engage with local communities to help expand the regional supply chain and workforce ecosystem required for semiconductor fabrication facilities, positioning businesses and jobseekers to participate in future project activities. The companies noted that nearly six additional jobs are expected to be created in the state economy for every direct Micron position.
“Our New York project will be home to the most advanced memory manufacturing in the world and will serve as a cornerstone of America’s leadership in the AI era,” said Manish Bhatia, executive vice president of global operations at Micron Technology. “We are entering an exciting new phase of construction. As the only U.S. manufacturer of memory, we know a project of this scale and complexity is only possible through the strength of partnership, and we are pleased to partner with Bechtel unlocking the full strength of their global capabilities, technical expertise, and world-class teams to bring this facility to life.”
“This project represents more than the construction of a semiconductor manufacturing campus, it is part of the foundation of America’s industrial future,” said Craig Albert, Bechtel’s president & chief operating officer. “Micron is making a generational investment in U.S. manufacturing, and Bechtel is bringing its world-class execution to deliver the foundation of long-term technology leadership and economic growth.” Semiconductor fabrication facilities are among the most complex industrial projects globally, requiring advanced cleanroom systems, ultra-high-purity infrastructure, sophisticated electrical networks, vibration-sensitive foundations, and highly controlled production environments. Through an integrated EPC delivery approach, Bechtel will deploy engineering, procurement, digital construction technologies, modularization methods, and project controls to support execution of the Micron New York Project while contributing to broader efforts to strengthen the resilience of the U.S. semiconductor supply chain.
